Qualcomm QCN9074

Qualcomm QCN9074 is a 5G modem chipset developed by Qualcomm Technologies, Inc. The chipset is designed to provide high-speed and low-latency 5G connectivity for a range of mobile devices, including smartphones, laptops, and tablets.

Qualcomm QCN9074 chipset supports both sub-6GHz and mmWave frequency bands, as well as 5G standalone (SA) and non-standalone (NSA) network architectures. It also supports dynamic spectrum sharing (DSS) technology, which enables the efficient use of 4G and 5G spectrum resources.

Qualcomm QCN9074 chipset features an integrated multi-mode modem, including support for 5G, 4G LTE, 3G, and 2G networks. It also includes advanced technologies such as Qualcomm? Snapdragon? X65 5G Modem-RF System, which supports advanced features such as carrier aggregation, 5G beamforming, and 5G carrier aggregation.

In addition, the QCN9074 chipset features advanced security features such as support for SIM-based authentication and the Qualcomm? Secure Processing Unit (SPU), which provides hardware-level security to protect user data.

Overall, the QCN9074 chipset is a powerful solution for enabling high-speed, low-latency 5G connectivity in a range of mobile devices, offering support for a wide range of frequencies and network architectures, as well as advanced security features.

Description

MX6974 F5 802.11ax Embedded Wireless modules that adopts M.2 E-key and supports PCI Express 3.0 protocol. It adopts Qualcomm? 802.11ax Wi-Fi technology, supports the 5180-5850GHz frequency band, has AP and STA functions with 4x4 MIMO and 4 spatial streams, suitable for applications of 5GHz IEEE802.11a/n/ac/ax. It is equipped with a dynamic frequency selection (DFS) function which has higher transmission efficiency than the previous generation.

Specifications

Type: Wireless Module

Chip: QCN9074

IEEE Standard: IEEE 802.11ax

Connector: PCI Express 3.0, M.2 E-key

Working voltage: 3.3V/5V

Frequency range: 5G：5.180GHz~5.850GHz

Modulation technology: 802.11n：OFDM（BPSK，QPSK，16-QAM，64-QAM，256-QAM）

802.11ac：OFDM（BPSK，QPSK，16-QAM，64-QAM，256-QAM）

802.11ax：OFDMA （BPSK，QPSK，DBPSK，DQPSK，16-QAM，64-QAM， 256-QAM，1024-QAM，4096-QAM）

Power (per chain): 802.11ax：Max. 21dBm

Power consumption: ≦15W

Receiving Sensitivity: 11ax:

HE20 MCS0 <-89dBm / MCS11 <-64dBm

HE40 MCS0 <-89dBm / MCS11 <-60dBm

HE80 MCS0 <-86dBm / MCS11 <-58dBm

Antenna Connector: 4 x U. FL

Operating Environment: Temperature: -20°C to 70°C/-4 ~ 158℉; Humidity: 95% (non-condensing)

Storage Environment: Temperature: -40°C to 90°C/-40 ~ 194℉; Humidity: 90% (non-condensing)

Certification: RoHS/REACH

Weight: 20g

Dimensions (W*H*D): 60 x 57 x 4.2 mm (±0.1mm)

Radio Frequency Parameters

Module Size